Chainmail-like material could be the future of armor

First 2D mechanically interlocked polymer exhibits exceptional flexibility and strength

In a remarkable feat of chemistry, a Northwestern University-led research team has developed the first two-dimensional (2D) mechanically interlocked material.

Resembling the interlocking links in chainmail, the nanoscale material exhibits exceptional flexibility and strength. With further work, it holds promise for use in high-performance, light-weight body armor and other uses that demand lightweight, flexible and tough materials.

Publishing tomorrow (Jan. 17) in the journal Science, the study marks several firsts for the field. Not only is it the first 2D mechanically interlocked polymer, but the novel material also contains 100 trillion mechanical bonds per 1 square centimeter — the highest density of mechanical bonds ever achieved. The researchers produced this material using a new, highly efficient and scalable polymerization process.

Read the full article on Northwestern Now.